Aluminum GPU Heatsink

Custom Aluminum GPU Heatsink

Aluminum heat sinks for GPUs are the go-to solution for moving heat from the fin stack to the air. When paired with copper at the thermal interface, they form the backbone of nearly every modernair-cooled graphics card: lightweight, economical, and reliably effective across the full spectrum, from budget cards to compact high-performance workstations.

I. Aluminum Heatsink for GPU Coolers

1. Integrated Cooling

Microsoft Surface RTX Spark Dev Box: Uses a compact aluminum chassis that doubles as a heatsink. The entire aluminum chassis provides passive cooling with no independent fans

2. General-Purpose Small Heatsinks are also suitable for GPUs, VRAM, and chips

Micro Heatsink: 9x9x5mm, aluminum alloy, suitable for 3D printers, IC chips, MOSFETs, GPUs, electronic chip sets, etc.

Small Heatsinks: 22x22x10mm, 28x11x28mm, 35x35x10mm (available with black anodized finish), 40x40x11mm, and other sizes, widely used for chips, VRAM, industrial control equipment, routers, etc.

Copper Pipe Composite Heatsink: Copper pipe with aluminum fin profile computer cooler, suitable for 2U computer servers, side-blown fan design for rapid heat dissipation.

Specification‌	Entry-Level Passive‌	Mainstream Air-Cooled‌	High-Performance Copper-Aluminum Hybrid‌	Low-Profile / SFF‌	Liquid Cooling Radiator (GPU)‌
Form Factor‌	Single-slot, fanless fin block	Dual-slot, axial fan + fin stack	Triple-slot, multi-fan + heat pipes	Half-height, slim fin array	External rad + water block
Dimensions (L×W×H)‌	150×100×15 mm	250×120×40 mm	320×140×60 mm	170×70×18 mm	360×120×27 mm (radiator)
Material	100% extruded aluminum (6063)	Aluminum fins (3003/6063), copper base plate	Copper cold plate, nickel-plated copper heat pipes, aluminum fins	Aluminum alloy (1050/6063)	Aluminum radiator core, copper water block
Thermal Conductivity‌	~160–200 W/m·K	~160–200 W/m·K (fins) / ~400 W/m·K (Cu base)	~400 W/m·K (Cu) / ~200 W/m·K (Al fins)	~200–237 W/m·K	~200 W/m·K (radiator)

II. Materials and Design Summary

The mainstream specifications of aluminum heatsinks for CPUs and GPUs can be summarized as follows:

Pure Aluminum Heatsinks: Lightweight and low cost, common dimensions range from 90x90mm to 120x120mm, suitable for low to mid-power platforms.

Aluminum with Copper Insert: A copper core embedded in an aluminum body, balancing thermal efficiency and cost.

Aluminum Radiators: 360mm size is mainstream, approximately 27mm thick, paired with copper cold plates and high-performance fans, used for flagship-level cooling.

Aluminum Chassis Cooling: Make the entire device chassis as a heatsink, ideal for compact Al development devices.

Micro Heatsinks: Various sizes from 9mm to 40mm, using adhesive mounting methods to dissipate heat fromsmall-area heat sources such as VRAM and IC chips.