|
| Quantity: | |
|---|---|
Custom Aluminium GPU Heatsink
Aluminium calor deprimit pro GPUs sunt go-solutionis ad calorem movendum ab ACERVUS PINNA ad aerem. Cum aeneo parantur in instrumento scelerisque, spinae graphicae fere recentis aeriae refrigeratae formant: leve pondus, oeconomicum, et per spectrum plenum fideliter efficax, a chartis praevisionibus ad operas operationes altas compactas.
I. Aluminium Heatsink pro GPU Coolers
1. Integrated Cooling
Microsoft Superficies RTX Scintilla Dev Box: Aluminium gb pacto utitur quod duplicat sicut heatsink. Totum aluminium chassis refrigerationem passivam praebet sine fans sui iuris
2. Propositum Generalis-Parvi Heatsinks aptae sunt etiam GPUs, VRAM, et astulae
Micro Heatsink: 9x9x5mm, aluminium stannum, 3D impressoribus aptum, assionibus IC, MOSFETs, GPUs, electronicis domunculis, etc.
Small Heatsinks : 22x22x10mm, 28x11x28mm, 35x35x10mm (praesto cum metam nigro anodized), 40x40x11mm, et aliae magnitudinum, late pro astularum, VRAM, instrumenti ditionis industrialis, iter itineris, etc.
Aeris Pipe composita Heatsink : fistula cuprea cum aluminio fino profile computatorie frigidiori, 2U servientibus computatris aptis, consilio ventilabro-inflato propter dissipationem caloris rapidi.
| Specification | Ingressum-Level passivum | Amet Air-Cooled | Aluminium Copper-Aluminium Hybrid | Low-Profile / SFF | Liquid Frigus Radiator (GPU) |
| Forma factor | Unius socors, fin- fanless scandalum | Dual-slot, axialis fan + fin acervus | Triplex socors, multi-farina + tibiae caloris | Medium altitudo, gracili pinna ordinata | Externi rad + aqua scandalum |
| Dimensiones (L×W×H) | 150×100×15 mm | 250×120×40 mm | 320×140×60 mm | 17070×18 mm | 360×120×27 mm (radiator) |
| Materia | C% aluminium extruditur (6063) | Aluminium pinnulis (3003/6063), lamella basi cuprea | Patella aeris frigida, nickel-patella, fistulae aeris caloris, aluminium pinnulis | Aluminium mixturae (1050/6063) | Aluminium nucleum radiator, aquae aeris scandalum |
| Scelerisque Conductivity | ~160-200 W/m·K | ~160-200 W/m·K (pinnulas) / ~ 400 W/m·K (Cu basi) | ~400 W/m·K (cu) / ~200 W/m·K (Al pinnulis) | ~200-237 W/m·K | ~200 W/m·K (radiator) |
II. Materials and Design Summary
Specificationes amet aluminii heatsinks pro CPUs et GPUs sic compendiari possunt:
Purum Aluminium Heatsinks: pondus leve et grave, dimensiones communes ab 90x90mm usque ad 120x120mm vagantur, apta ad humilem ad medium potentiae suggestum.
Aluminium cum Cupreis Insert : Core aeris in corpus aluminii infixa, efficientiam et sumptus aequans.
Aluminium Radiators : 360mm magnitudo amet, circiter 27mm crassa, paribus cum laminis aeneis frigidis et summo operandi fans, pro gradu navis refrigerationis adhibita.
Aluminium Chassis Refrigerium : Fac chassis totam machinam sicut heatsink, specimen pacti Al evolutionis machinis.
Micro Heatsinks : Moles variae ab 9mm ad 40mm, adhibitis tenaces inscendendi modos ad calorem dissipandum ab area caloris ab exiguo fontibus ut VRAM et IC xxxiii.
