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Aluminum Heatsink
HS-al-0104
Engineered to solve complex thermal challenges, our Customizable Aluminum Heating Sinks offer tailored thermal management solutions for high-power electronics, ideal for IGBT modules, LED drivers, and renewable energy systems. Crafted from 6063-T6 aluminum with optional copper inserts, these sinks feature optimized fin geometries and surface treatments, ensuring efficient heat dissipation in extreme environments (-50°C to 200°C).
Thermal Design Flexibility
Fin Geometry:
Straight fins (10-80mm height) for natural convection, louvered fins (30° angle) for forced-air applications (airflow 50-200 CFM).
Micro-channel design (0.5mm width) increases surface area by 40% for compact devices (e.g., 5G power amplifiers).
Material Enhancements:
Copper base bonding (1-3mm thickness) boosts thermal conductivity to 250 W/mK, reducing thermal resistance by 25%.
Heat pipe integration (6mm diameter) achieves isothermal heat spread, eliminating hotspots in high-flux areas (≥100 W/cm²).
Precision Manufacturing
Extrusion & Machining: High-precision extrusions (straightness ≤0.1mm/m) followed by CNC machining for mounting features (tolerance ±0.1mm), compatible with standard thermal interface materials.
Surface Treatments:
Type III hard anodizing (50μm) for wear resistance (HV 300) and dielectric strength (1000V DC).
Black chrome plating (3-5μm) for high emissivity (≥0.85), enhancing radiation heat transfer in enclosed spaces.
Modular Construction
Mounting Options: Screw mounts (M3-M8), clip brackets, and adhesive pads for easy integration with PCBs and heat spreaders.
Custom Sizing: Sink dimensions from 50x50x10mm to 300x200x50mm, with optional side panels for fan integration (noise ≤25dB).
Power Inverters: Cools solar inverters and EV charging stations, maintaining junction temperature <150°C under full load (compliant with IEC 61204-3).
LED Lighting: High-power LED arrays in stadium lights and streetlights, preventing lumen depreciation (junction temperature ≤85°C).
Aerospace Electronics: Avionics cooling in harsh environments, with lightweight designs (density 2.7g/cm³) compliant with RTCA/DO-160G thermal shock.
Thermal Simulation Expertise
ANSYS Fluent simulations optimize fin pitch and thickness, ensuring 15% higher heat dissipation than generic designs in the same form factor.
Rapid Prototyping
3D-printed aluminum prototypes (SLM technology) available in 72 hours, with in-house thermal testing (Hot Disk analyzer, accuracy ±5%).
Quality Assurance
100% thermal resistance testing (JEDEC JESD51-1) and dye penetrant inspection for casting defects, compliant with IPC-7251B standards.
Sustainability Focus
100% recycled aluminum options (post-industrial waste ≥90%) and RoHS 3.0-compliant coatings, aligning with global green manufacturing goals.
Engineered to solve complex thermal challenges, our Customizable Aluminum Heating Sinks offer tailored thermal management solutions for high-power electronics, ideal for IGBT modules, LED drivers, and renewable energy systems. Crafted from 6063-T6 aluminum with optional copper inserts, these sinks feature optimized fin geometries and surface treatments, ensuring efficient heat dissipation in extreme environments (-50°C to 200°C).
Thermal Design Flexibility
Fin Geometry:
Straight fins (10-80mm height) for natural convection, louvered fins (30° angle) for forced-air applications (airflow 50-200 CFM).
Micro-channel design (0.5mm width) increases surface area by 40% for compact devices (e.g., 5G power amplifiers).
Material Enhancements:
Copper base bonding (1-3mm thickness) boosts thermal conductivity to 250 W/mK, reducing thermal resistance by 25%.
Heat pipe integration (6mm diameter) achieves isothermal heat spread, eliminating hotspots in high-flux areas (≥100 W/cm²).
Precision Manufacturing
Extrusion & Machining: High-precision extrusions (straightness ≤0.1mm/m) followed by CNC machining for mounting features (tolerance ±0.1mm), compatible with standard thermal interface materials.
Surface Treatments:
Type III hard anodizing (50μm) for wear resistance (HV 300) and dielectric strength (1000V DC).
Black chrome plating (3-5μm) for high emissivity (≥0.85), enhancing radiation heat transfer in enclosed spaces.
Modular Construction
Mounting Options: Screw mounts (M3-M8), clip brackets, and adhesive pads for easy integration with PCBs and heat spreaders.
Custom Sizing: Sink dimensions from 50x50x10mm to 300x200x50mm, with optional side panels for fan integration (noise ≤25dB).
Power Inverters: Cools solar inverters and EV charging stations, maintaining junction temperature <150°C under full load (compliant with IEC 61204-3).
LED Lighting: High-power LED arrays in stadium lights and streetlights, preventing lumen depreciation (junction temperature ≤85°C).
Aerospace Electronics: Avionics cooling in harsh environments, with lightweight designs (density 2.7g/cm³) compliant with RTCA/DO-160G thermal shock.
Thermal Simulation Expertise
ANSYS Fluent simulations optimize fin pitch and thickness, ensuring 15% higher heat dissipation than generic designs in the same form factor.
Rapid Prototyping
3D-printed aluminum prototypes (SLM technology) available in 72 hours, with in-house thermal testing (Hot Disk analyzer, accuracy ±5%).
Quality Assurance
100% thermal resistance testing (JEDEC JESD51-1) and dye penetrant inspection for casting defects, compliant with IPC-7251B standards.
Sustainability Focus
100% recycled aluminum options (post-industrial waste ≥90%) and RoHS 3.0-compliant coatings, aligning with global green manufacturing goals.
