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Heat sink
WANDA-AN
HS-Black-001
CNC ALUMINUM HEAT SINK
OVERVIEW
Precision heat sinks are critical components in electronic cooling systems, designed to
dissipate heat efficiently from high-power electronic devices such as CPU, GPU,
power electronics,LED systems, and telecommunications equipment. These heat sinks
are fabricated using advanced machining techniques to ensure high thermal conductivity,
dimensional accuracy, and optimal airflow.
And the performance of an aluminum heat sink depends on several factors, including material properties,
design, airflow conditions, and application requirements.
The best heat sink types for electronic cooling depend on power dissipation, space constraints, airflow, and cost.
such as the Skived Fin Heat Sinks,Vapor Chamber Heat Sinks,Pin-Fin Heat Sinks,etc.
Key Features of Precision Heat Sinks
High Thermal Conductivity:Made from materials like aluminum (6061, 6063)
or copper (C110) for efficient heat transfer.
Custom Fin Designs:Optimized fin geometry (straight, pin-fin, flared) for
enhanced surface area and cooling performance.
Lightweight & Durable:Machined aluminum offers a good strength-to-weight ratio,
while copper provides superior heat dissipation.
Precision Machining:CNC milling, extrusion, or die-casting ensures tight
tolerances (±0.05mm) for perfect fitment.
Surface Treatments:Anodizing (for corrosion resistance) or nickel plating
(for improved solderability in copper heat sinks).
Compatibility:Designed for forced-air (fans) or passive cooling systems.
Manufacturing & Processing Methods
CNC Machining:High-precision milling/lathing for complex geometries and custom shapes.
Extrusion:Cost-effective for high-volume production of standard aluminum heat sinks.
Die Casting:Suitable for intricate designs with good thermal properties.
Bonded Fin Technology:Combines separate fins with a base plate for high-performance cooling.
Skiving:Thin, high-density fins cut from a solid block for improved heat dissipation.
Additive Manufacturing (3D Printing):Used for prototyping or complex, topology-optimized designs.
Applications
Consumer Electronics:Laptops, smartphones, gaming consoles.
Telecom & Networking:5G base stations, routers, switches.
Automotive & EV:Battery cooling, power inverters, LED headlights.
Industrial Electronics:Motor drives, power supplies, IGBT modules.
Aerospace & Defense:Avionics cooling, radar systems.
Medical Devices:Imaging equipment, high-power laser systems.
Parameter | Aluminum Heat Sink | Copper Heat Sink |
Material | 6061/6063 Al | C110 Copper |
Thermal Conductivity | 160-180 W/mK | 385 W/mK |
Density | 2.7 g/cm³ | 8.96 g/cm³ |
Max Operating Temp | ~200°C | ~300°C |
Surface Finish | Anodized (Black/Color) | Nickel Plated |
Tolerance | ±0.05mm – ±0.1mm | ±0.05mm – ±0.1mm |
CNC ALUMINUM HEAT SINK
OVERVIEW
Precision heat sinks are critical components in electronic cooling systems, designed to
dissipate heat efficiently from high-power electronic devices such as CPU, GPU,
power electronics,LED systems, and telecommunications equipment. These heat sinks
are fabricated using advanced machining techniques to ensure high thermal conductivity,
dimensional accuracy, and optimal airflow.
And the performance of an aluminum heat sink depends on several factors, including material properties,
design, airflow conditions, and application requirements.
The best heat sink types for electronic cooling depend on power dissipation, space constraints, airflow, and cost.
such as the Skived Fin Heat Sinks,Vapor Chamber Heat Sinks,Pin-Fin Heat Sinks,etc.
Key Features of Precision Heat Sinks
High Thermal Conductivity:Made from materials like aluminum (6061, 6063)
or copper (C110) for efficient heat transfer.
Custom Fin Designs:Optimized fin geometry (straight, pin-fin, flared) for
enhanced surface area and cooling performance.
Lightweight & Durable:Machined aluminum offers a good strength-to-weight ratio,
while copper provides superior heat dissipation.
Precision Machining:CNC milling, extrusion, or die-casting ensures tight
tolerances (±0.05mm) for perfect fitment.
Surface Treatments:Anodizing (for corrosion resistance) or nickel plating
(for improved solderability in copper heat sinks).
Compatibility:Designed for forced-air (fans) or passive cooling systems.
Manufacturing & Processing Methods
CNC Machining:High-precision milling/lathing for complex geometries and custom shapes.
Extrusion:Cost-effective for high-volume production of standard aluminum heat sinks.
Die Casting:Suitable for intricate designs with good thermal properties.
Bonded Fin Technology:Combines separate fins with a base plate for high-performance cooling.
Skiving:Thin, high-density fins cut from a solid block for improved heat dissipation.
Additive Manufacturing (3D Printing):Used for prototyping or complex, topology-optimized designs.
Applications
Consumer Electronics:Laptops, smartphones, gaming consoles.
Telecom & Networking:5G base stations, routers, switches.
Automotive & EV:Battery cooling, power inverters, LED headlights.
Industrial Electronics:Motor drives, power supplies, IGBT modules.
Aerospace & Defense:Avionics cooling, radar systems.
Medical Devices:Imaging equipment, high-power laser systems.
Parameter | Aluminum Heat Sink | Copper Heat Sink |
Material | 6061/6063 Al | C110 Copper |
Thermal Conductivity | 160-180 W/mK | 385 W/mK |
Density | 2.7 g/cm³ | 8.96 g/cm³ |
Max Operating Temp | ~200°C | ~300°C |
Surface Finish | Anodized (Black/Color) | Nickel Plated |
Tolerance | ±0.05mm – ±0.1mm | ±0.05mm – ±0.1mm |